Real-time monitoring: Comprehensive data acquisition and process control, with full visibility of equipment status, process parameters, and order progress.

The MES system achieves closed-loop control of the entire electroplating process, covering four major dimensions:

Full traceability: Each batch of products can be precisely traced back to key parameters such as plating time, current density, and chemical consumption.

Closed-loop optimization: automatically generate analysis reports, identify defects and trigger corrective actions, forming a "detection-feedback-adjustment" closed loop.

Stable production: abnormal shutdown early warning, process deviation prompts, preventive maintenance reminders.

Film thickness tester | Atomic absorption spectrophotometer | Spectrophotometer | Two-dimensional image measuring instrument | Salt spray testing machine | Steam aging test machine | High-temperature oven | Spectrometer | Melt indexer | Moisture meter | Infrared spectrometer